Ultra-fine circuit formation (fine pitch/fine pattern)
Ultrafine circuit formation (fine pitch/fine pattern)
Our company offers proposals for the prototyping and mass production of flexible substrates, not only through etching and plating technologies for printed circuit boards but also through various thin film deposition processes for metal conductors using vacuum deposition and sputtering techniques, applying technologies across different industries. We support not only circuit formation using subtractive methods but also fine wiring with the Modified Semi-Additive Process (MSAP). Primarily focusing on circuit formation on flexible substrates such as transparent flexible substrates, we also provide patterning processes for glass, film ITO, and metal films, combining thin film formation technology, etching technology, and plating technology in our proposals. Additionally, we accommodate fine pattern processing for the formation of micro and narrow pitch bumps, as well as redistribution layers (RDL) for wafer-level packages (WLP).
- Company：サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
- Price：Other
